Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad

Customization: Available
Certification: RoHS, ISO9001
Type: Thermal Pad

Products Details

  • Overview
  • Product Description
  • Detailed Photos
  • Company Profile
  • After Sales Service
  • FAQ
Overview

Basic Info.

Model NO.
TFLEX UT20000
Thickness Range
200 µ- 1000 µ
Thermal Conductivity
3.0
Density (G/Cc)
3.2
Temperature Range
-50°c to 200°c
Hardness Shore 00
83.3 (200-375) µm 56.4* (400-1000) µm
Rth@ 200 µm, 10 Psi, 500 C
0.25°c–in2/W
Dielectric Constant @ 1 MHz
5.87
Volume Resistivity
2.2 X 10^15 Ohm-Cm
Transport Package
Land and Air; Carton, 200 Per Pack
Specification
Private message communication
Trademark
Laird
Origin
USA
Production Capacity
50000 Pieces/Day

Product Description

 

Product Description
 
 
 

       Tflex UT20000 is a state-of-the-art thermal interface material meticulously designed for thin interfaces. This revolutionary product delivers outstanding thermal performance and exceptional compliancy, making it the perfect choice for applications where space is at a premium and efficient heat dissipation is essential.It is expertly crafted without embedded reinforcing fiberglass to reduce contact resistance while ensuring easy handling and durability during assembly.Tflex™ UT20000 is electrically non-conductive, ensuring safe and reliable performance.A polyimide film option is available to enhance electrical resistance and provide a tear-resistant top surface.
       With Tflex UT20000, users can expect dependable thermal conductivity and optimal heat transfer, ensuring that electronic components remain cool and operational. Its ultra-thin design facilitates easy application in confined spaces, offering a seamless solution for thermal management in diverse electronic devices.


      Features and benefits:

     • Silicone-free gap filler for versatile applications
    • Naturally tacky for adhesion during assembly and transport
    • Outstanding surface wetting for minimal contact resistance
    • Exceptionally low thermal resistance for maximum efficiency
    • No Fiberglass reinforcement, enhancing flexibility
 and ease of handling

    
 
 
Detailed Photos

Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
 

Company Profile

 

 

 Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
       Dongguan City U.ONE Electronic Technology Co., Ltd. was officially established in 2009. It is a professional enterprise in China that integrates research and development, agency, processing, production, and sales of thermal conductivity, conductivity, and insulation products. The company has a production and research base of approximately 3000 square meters, located at No. 20 Nonglin Road, Long bei Ling Village, Tangxia town, Dongguan city, Guangdong province, China. Adhering to the business philosophy of "service first, quality first, and reasonable prices", the company has established long-term cooperative relationships with multiple enterprises across the country.
       Mainly product: thermal pad, thermal grease,phase change material ,mylar ,silicone rubber sheet, foam, ,silicone products,etc. Products can provide customized services, including customized sizes, customized label,customized packaging, for customers to choose.

 

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Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
 
Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
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Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
 

Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad
After Sales Service

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FAQ

 

Tflex Ut20000 Is Formulated Ultra-Thin Gap Filler Thermal Interface Material, Thermal Pad

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